Resists, Developers and Removers
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چکیده
Positive resists form an indene carboxylic acid during exposure making them soluble in aqueous alkaline solutions. Therefore, positive resists develop where they have been exposed, while the unexposed areas remain on the substrate. Since positive resists do not cross-link, the resist structures rounden beyond their softening point of typically 100-130°C. Negative resists such as the AZ® nLOF 2000 series or the AZ® 15 nXT or 125 nXT crosslink after exposure and (not required for the AZ® 125 nXT) a subsequent baking step, while the unexposed part of the resist is dissolved in the developer. The crosslinking makes the resist thermally stable, so even elevated temperatures will not deteriorate the resist profile. However, towards higher and higher process temperatures, the degree of crosslinking increases and it becomes hard or even impossible to wet-chemically remove the resist. Image reversal resists can either be processed in positive or negative mode. In the positive mode, the process sequence is the same as for positive resists. In the image reversal mode, an image reversal bake after the exposure followed by a flood exposure without mask is required. Even in the negative mode, the degree of crosslinking of the resist is rather low, so the resist structures will rounden beyond the softening point of typically 130°C.
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